technical data 4109 product description ? compact footprint ? designed for high density, high current/low voltage applications ? foil technology that adds higher reliability factor over the traditional magnet wire used for higher frequency circuit designs ? frequency range up to 1mhz applications ? distributed power systems dc-dc converters ? general-purpose low voltage supplies ? computer systems ? servers ? point of load (pol) converters ? industrial equipment ? networking/telecom power supplies environmental data ? storage temperature range (component): - 40c to +125c ? operating temperature range: -40c to +125c (ambient + self-temperature rise). ? solder reflow temperature: j-std-020d compliant hc2 high current power inductors pb effective october 2015 supersedes august 2006
2 technical data 4109 effective october 2015 hc2 high current power inductors product specifications part number part number (tape and reel) ocl 1 (h) 20% l rms 2 amps l sat 3 amps dcr ( ) 4 maximum @ 20c volt-sec 5 (v-s) hc2-r47-r hc2-r47tr-r .52 52.9 63.75 .0006 6.87 hc2-r68-r hc2-r68tr-r .63 52.9 50.00 .0006 6.87 HC2-1R0-R hc2-1r0tr-r 1.15 33.0 42.50 .0013 10.31 hc2-2r2-r hc2-2r2tr-r 2.00 24.3 31.90 .0023 13.75 hc2-4r7-r hc2-4r7tr-r 4.55 17.0 21.25 .0046 20.62 hc2-6r0-r hc2-6r0tr-r 6.00 17.0 16.50 .0046 20.62 1. open circuit inductance test parameters: 300khz, 0.250 vrms, 0.0 adc 2. dc current for an approximate temperature change of 40c without core loss. derating is necessary for ac currents. pcb layout, trace thickness and width, air-fow and proximity of other heat generating components will affect the temperature rise. it is recommended that the temperature of the part not exceed 125c under worst case operating conditions verifed in the end application. 3. peak current for approximately 30% rolloff. 4. values @ 20c 5. applied volt-time product (v-s) across the inductor. this value represents the applied v-s at 300khz neccessary to generate a core loss equal to 10% of the total losses for 40c temperature rise. dimensionsCmm packaging information (mm) bulk packaging: 45 parts per tray tape and reel packaging: 110 parts per 13 diameter reel w wll yy r h c 2-xxx ao= 1 9 . 3 m m bo= 1 9 . 3 m m k o= 12. 9 m m 4 0 . 4 +/-0.1 0 44. 0 +/-0.3 0 k o 32 a o a 1 .7 5 2 0 . 2 2. 0 1 .5dia + 0 .1 0 -0 . 00 2. 0 di a min 4. 0 a us er direction of feed s e c ti o n a- a bo b r 0 .5 re f 1 2 19 . 00 10 . 00 5 . 50 5.5 0 19 . 2 m a x 19 . 0 ma x 9 . 5 typ 12.7 ma x 3 . 5 typ 2. 3 typ f r o nt vie w t o p vie w sc hemati c 2 re co mmended p c b pad lay out h c 2 - xxx w wll yy r 1 www.eaton.com/elx
3 technical data 4109 effective october 2015 hc2 high current power inductors rolloff core loss i rms dera ting with core los s 1000 800 600 500 400 300 200 100 80 60 50 40 30 20 10 % of applied vo lt- -seconds 99 98 97 96 95 94 92 90 80 70 60 50 40 20 0 % o f l o ss es f r o m ir m s (m ax im u m ) 1 mh z 5 0 0k h z 30 0 kh z 200 k h z 10 0k hz induct ance versus sa tura tion current 02 04 06 08 01 00 1201 40 1601 80 200 0 10 20 30 40 50 60 70 80 90 100 % of i sa t % of ocl www.eaton.com/elx
hc2 high current power inductors technical data 4109 effective october 2015 temperature t t p t s t c -5c ti me 25 c to pe ak ti me 25 c t sm in t sm ax t l t p prehea t a ma x. ra mp up ra te = 3 c/ s ma x. ra mp do wn ra te = 6 c/ s solder reflow profile reference jdec j-std-020d profile feature standard snpb solder lead (pb) free solder preheat and soak ? temperature min. (t smin ) 100c 150c ? temperature max. (t smax ) 150c 200c ? time (t smin to t smax ) (t s ) 60-120 seconds 60-120 seconds average ramp up rate t smax to t p 3c/ second max. 3c/ second max. liquidous temperature (t l l * tolerance for peak profile temperature (t p ) is defined as a supplier minimum and a user maximum. ** tolerance for time at peak profile temperature (t p ) is defined as a supplier minimum and a user maximum. table 1 - standard snpb solder (t c ) package thickness volume mm3 <350 volume mm3 350 <2.5mm) 235c 220c 2.5mm 220c 220c table 2 - lead (pb) free solder (t c ) package thickness volume mm 3 <350 volume mm 3 350 - 2000 volume mm 3 >2000 <1.6mm 260c 260c 260c 1.6 C 2.5mm 260c 250c 245c >2.5mm 250c 245c 245c eaton electronics division 1000 eaton boulevard cleveland, oh 44122 united states www.eaton.com/elx ? 2015 eaton all rights reserved printed in usa publication no. 4109 october 2015 eaton is a registered trademark. all other trademarks are property of their respective owners. life support policy: eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an offcer of the company. life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in signifcant injur y to the user. eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribu tion of any products. eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin.
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